Murata Launches Low-Power Wi-Fi/Bluetooth Combo Module for Battery-Powered IoT Devices
Murata has released a new low-power Wi-Fi/Bluetooth combo module called the "Type 2GF" in collaboration with Infineon Technologies. This module is designed to help increase the availability of battery-powered IoT devices.
As the IoT market has grown, there has been an increase in IoT devices that come equipped with wireless communication capabilities. Different applications now demand specific wireless communication specifications, and there is a trend towards requiring lower power consumption for wireless functions on battery-powered devices.
Murata has created a product with CYW43022 integrated, utilizing their wireless design and product processing technology to meet the demand for low power consumption. The CYW43022 chip enables connectivity even when the host processor is in sleep mode, reducing power consumption at the system level. Additionally, the product was made more compact by using smaller noise shields on the module.
To learn more, please visit this
Würth Elektronik has introduced a high-current inductor for use in automotive applications. Nexperia has launched NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has introduced its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics is showcasing its microcontroller innovations and ultra low power MCUs. The company is committed to empowering edge AI innovation. STMicroelectronics is also advancing power electronics for aircraft electrification and supporting wireless connectivity with STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.