Murata Revolutionizes IoT Equipment with Low-Power Wi-Fi/Bluetooth Combo Module
Murata has introduced a new low-power Wi-Fi/Bluetooth module called the "Type 2GF," designed to support battery-powered IoT devices. This module features the Infineon Technologies "CYW43022" chip, which combines Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.
In the past few years, the IoT market has seen an increase in the variety of applications, leading to a higher demand for IoT equipment with wireless communication capabilities. Different types of wireless communication functions are now needed based on the specific application. In addition, there is a growing need for wireless communication functions in battery-powered devices to have lower power consumption.
Murata has created a product with low power consumption by incorporating CYW43022, thanks to their wireless design technology and product processing technology. CYW43022 allows for connectivity even when the host processor is in sleep mode, reducing power usage at the system level. Additionally, the product was made more compact by using smaller noise shields, saving space on the module.
For additional details, please click here
Würth Elektronik has introduced a high-current inductor specifically designed for automotive use. Nexperia has launched NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has presented its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics is showcasing its microcontroller innovations and ultra low power MCUs. The company is committed to empowering edge AI innovation. STMicroelectronics is also advancing power electronics for aircraft electrification and supporting wireless connectivity with STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with the U.S. Commerce Department for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.