Technology

Murata’s Low-Power Wi-Fi/Bluetooth Module to Drive Battery-Powered IoT Equipment Growth

Murata has introduced a new low-power Wi-Fi/Bluetooth combination module called the "Type 2GF," designed to help expand the use of battery-operated IoT devices. This module includes the Infineon Technologies' "CYW43022" chip, which combines Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.

In the past few years, the IoT market has seen a growth in the use of applications, leading to an increase in IoT devices with wireless communication capabilities. Different specifications for wireless communication functions have become more varied based on the specific application. In order to accommodate battery-powered devices, there is a growing demand for wireless communication functions to consume less power.

Murata has created a product with CYW43022 integrated, using their own wireless design technology and product processing technology to meet the demand for low power consumption. The CYW43022 chip enables connectivity even when the host processor is in sleep mode, thanks to its Bluetooth stack and Wi-Fi network offloading capabilities, ultimately reducing power consumption at the system level. Additionally, the product was made more compact by utilizing smaller noise shields, saving space on the module.

To learn more, please visit this

Würth Elektronik has introduced a high-current inductor specifically designed for automotive use. Nexperia has launched NPS3102A and NPS3102B eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has also presented its WE-MXGI series power inductors for DC/DC converters. STMicroelectronics is focusing on microcontroller innovations and ultra-low power MCUs to drive innovation in the industry. They are also advancing power electronics for aircraft electrification and supporting wireless connectivity with their STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance.

Related Articles

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button