Murata’s Low-Power Wi-Fi/Bluetooth Combo Module: Revolutionizing Battery-Powered IoT Equipment
Murata has introduced a new Wi-Fi/Bluetooth combo module called "Type 2GF" that is designed to help increase the use of battery-powered IoT devices. This module is compact and low-power, and it features the Infineon Technologies "CYW43022" chip for Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.
In recent years, the IoT market has seen a growth in applications leading to an increase in IoT devices with wireless communication capabilities. Different applications require wireless communication functions to have varied specifications. Battery-powered devices are now demanding lower power consumption from their wireless communication functions.
Murata has created a product with low power consumption capabilities by incorporating CYW43022 into it. This chip enables connectivity even when the host processor is in sleep mode, thanks to its Bluetooth stack and Wi-Fi network offloading capabilities. As a result, the product consumes less power overall. Additionally, the use of smaller noise shields helped save space on the module, making the product more compact.
To find out more details, please
Würth Elektronik has unveiled a new high-current inductor designed for use in automotive applications. Nexperia has introduced NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has launched AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has also released its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics is leading the way in microcontroller innovations and ultra low power MCUs. They are committed to empowering edge AI innovation and advancing power electronics for aircraft electrification. STMicroelectronics' STM32 MCUs support wireless connectivity. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with the U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance.