Accelerating Chip Innovation: Synopsys’ Multi-Die Reference Flow for Intel Foundry’s EMIB Technology
Synopsys is speeding up the development of new chips by offering a ready-to-use multi-die reference flow for Intel Foundry. Their 3DIC Compiler Co-Design and Analysis Solution, when used with Synopsys IP, helps to quickly integrate different types of components for Intel Foundry's EMIB Technology.
Key points
Synopsys, Inc. has introduced a fully developed multi-die reference flow, utilizing the Synopsys.ai EDA suite and Synopsys IP for Intel Foundry's EMIB technology. This optimized flow allows for co-design and analysis, supported by Synopsys 3DIC Compiler, to speed up the exploration and development of multi-die designs from silicon to system integration. Additionally, the integration of Synopsys 3DSO.ai with Synopsys 3DIC Compiler allows for optimization of signal, power, and thermal integrity, resulting in improved productivity and system performance.
"As the need for more bandwidth increases, companies are quickly adopting multi-die designs to enhance the processing power and performance of their AI and high-performance computing applications," explained Sanjay Bali, who serves as the vice president of strategy and product management for the Synopsys EDA Group. Through a strong partnership with Intel Foundry, they have developed a production-ready AI-driven multi-die reference flow for EMIB technology, offering customers a comprehensive solution for developing complex multi-die systems with billions to trillions of transistors."
Suk Lee, who is the Vice President and General Manager of the Ecosystem Technology Office at Intel Foundry, emphasized the importance of taking a comprehensive approach to addressing the complexities of multi-die architectures in terms of design and packaging. By leveraging Intel Foundry's manufacturing and advanced packaging technologies, along with Synopsys' certified multi-die reference flow and trusted IP, designers can access a scalable solution for quickly integrating heterogeneous components using Intel Foundry's EMIB technology.
Synopsys provides a comprehensive and scalable solution for fast integration of multiple dies using AI technology. This solution allows for early exploration of architecture, quick software development, efficient co-design of dies and packaging, strong connectivity between dies, and improved manufacturing and reliability. The 3DIC Compiler, a key component of this solution, is integrated with Ansys RedHawk-SC Electrothermal technology to ensure power and thermal signoff for 2.5D/3D multi-die designs. The solution also includes Synopsys 3DSO.ai, an AI-driven optimization engine for improving system performance and quality of results for 2.5D and 3D multi-die designs.
Synopsys is creating intellectual property (IP) for Intel Foundry's process technologies, which includes the necessary connections for constructing multi-die packages with less risk of integration issues and a faster time-to-market. By using Synopsys IP and Synopsys 3DIC Compiler, there can be a 30% decrease in workload and a 15% enhancement in results quality (measured by margin) compared to manual processes. This is achieved through automation of routing, interposer studies, and signal integrity analysis.
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