Murata Commercializes Low-Power Wi-Fi/Bluetooth Combo Module: Revolutionizing Battery-Powered IoT Equipment
Murata has introduced a new low-power Wi-Fi/Bluetooth module called "Type 2GF" that is designed to help expand the use of battery-powered IoT devices. This module includes the Infineon Technologies "CYW43022" chip, which combines Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.
In recent years, as the use of IoT applications has grown, there has been an increase in IoT devices with wireless communication capabilities. The requirements for wireless communication functions have become more varied, depending on the specific application. Additionally, wireless communication functions for battery-powered devices are now expected to consume less power.
In order to meet the demand for low power consumption, Murata has utilized their own wireless design technology and product processing technology to create a product with CYW43022 integrated. This chip allows for connectivity even when the host processor is in sleep mode, thanks to its Bluetooth stack and Wi-Fi network offloading capabilities. This helps reduce power consumption at the system level. Additionally, space was saved on the module by using smaller noise shields, making the product more compact.
To find out more, please visit
Würth Elektronik has introduced a high-current inductor designed for use in automotive applications. Nexperia has released NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has launched AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has unveiled its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is also discussed. STMicroelectronics has been showcasing its microcontroller innovations and ultra low power MCUs. They are also focusing on empowering edge AI innovation and advancing power electronics for aircraft electrification. STMicroelectronics' STM32 MCUs now support wireless connectivity. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.