Murata Introduces Low-Power Wi-Fi/Bluetooth Combo Module for Battery-Powered IoT Devices
Murata is now selling a new low-power Wi-Fi/Bluetooth combination module that is designed to support battery-powered IoT devices. This module, known as "Type 2GF," is compact and has the Infineon Technologies "CYW43022" chip integrated for Wi-Fi, Bluetooth, and Bluetooth Low Energy functionality.
The IoT market has seen growth in the number of applications in recent years, leading to an increase in IoT devices that incorporate wireless communication capabilities. The requirements for wireless communication functions have become more varied depending on the specific application. In the case of battery-powered devices, there is a growing demand for wireless communication functions that consume less power.
Murata has created a product with low power consumption capabilities by incorporating CYW43022, a chip with connectivity processing capabilities, into its design. This chip allows the product to maintain connectivity even when the host processor is in sleep mode, reducing power consumption at the system level. Additionally, the product's size was minimized by using smaller noise shields, making it more compact.
To find out more, please visit
Würth Elektronik has introduced a new high-current inductor specifically designed for automotive use. Nexperia has launched NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors suitable for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has unveiled its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics is dedicated to fostering innovation in microcontroller technologies and ultra-low power MCUs. They are also committed to advancing power electronics for aircraft electrification and supporting wireless connectivity with their STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with the U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.