Technology

Murata Launches Low-Power Wi-Fi/Bluetooth Combo Module to Drive Battery-Powered IoT Equipment Growth

Murata has released a new low-power Wi-Fi/Bluetooth combo module called the "Type 2GF" that is designed to support battery-powered IoT devices. This module includes the Infineon "CYW43022" chip, which enables Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.

In the past few years, the IoT market has seen a growth in the use of wireless communication-enabled equipment. Different applications now require wireless communication functions with specific specifications tailored to their needs. In the case of devices running on batteries, there is a demand for wireless communication functions to consume less power.

To meet the need for low power consumption, Murata utilized their wireless design technology and product processing technology to create a product with CYW43022 integrated. This chip enables the product to maintain connectivity even when the host processor is in sleep mode, thanks to its Bluetooth stack and Wi-Fi network offloading capabilities. As a result, the product consumes less power overall. Additionally, the product was made more compact by reducing the size of noise shields typically found in modules.

To find out more, please visit

Würth Elektronik is showcasing a high-current inductor designed for use in automotive applications. Nexperia has introduced NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has launched AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are available for bridge rectifiers. Würth Elektronik has introduced its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics is continuing to showcase innovations in microcontrollers and ultra low power MCUs. They are also committed to empowering edge AI innovation. STMicroelectronics is advancing power electronics for aircraft electrification and supporting wireless connectivity with their STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with the U.S. Commerce Department for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.

Related Articles

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button