Technology

Murata Launches Low-Power Wi-Fi/Bluetooth Module to Drive Battery-Powered IoT Adoption

Murata has released a new low-power Wi-Fi/Bluetooth combination module called the "Type 2GF" that is designed to help increase the use of battery-powered IoT devices. The module features the Infineon Technologies "CYW43022" chip, which combines Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.

The IoT market has seen an increase in applications in recent years, leading to a growth in IoT devices that have wireless communication capabilities. These devices now require a variety of specifications for their wireless communication functions, depending on the specific application they are used for. In addition, there is a growing demand for wireless communication functions in battery-powered devices to have lower power consumption.

To meet the need for low power consumption, Murata utilized their wireless design technology and product processing technology to create a product with CYW43022 integrated, enabling it to consume less power. The CYW43022 chip can maintain connectivity even when the host processor is in sleep mode, thanks to its Bluetooth stack and Wi-Fi network offloading capabilities. By using smaller noise shields, space was saved on the module, making the product more compact.

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In this series of articles, various companies are introducing new products and technologies for different applications in the automotive and electronics industries. Würth Elektronik has unveiled a high-current inductor for automotive use, while Nexperia has introduced high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has launched thin film chip resistors for high frequency applications up to 70 GHz. Additionally, Würth Elektronik has introduced power inductors for DC/DC converters. STMicroelectronics is also highlighted for their innovations in microcontrollers and power electronics for aircraft electrification. Additionally, HyRel Technologies has successfully recertified to AS9100 standards and Amkor has signed preliminary terms for a significant investment in Arizona. JEDEC has also announced new standards for DDR5 and LPDDR6 technologies.

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