Murata’s Low-Power Wi-Fi/Bluetooth Combo Module Revolutionizes Battery-Powered IoT Equipment
Murata has introduced a new low-power Wi-Fi/Bluetooth combo module called the "Type 2GF", designed to support battery-powered IoT devices. This module features the Infineon Technologies "CYW43022" chip, and is now in mass production.
The IoT market has seen growth in recent years, leading to an increase in IoT devices that utilize wireless communication. The requirements for wireless communication functions have become more varied depending on the application. In particular, there is a growing need for lower power consumption in wireless communication functions for battery-powered devices.
Murata has developed a product with low power consumption capabilities by incorporating CYW43022, utilizing their wireless design technology and product processing technology. This chip allows for connectivity maintenance even when the host processor is in sleep mode, reducing power consumption at the system level. Additionally, the use of smaller noise shields on the module helped save space and make the product more compact.
To find out more, please visit
Würth Elektronik has introduced a high-current inductor specifically designed for use in automotive applications. Nexperia has launched the NPS3102A and NPS3102B High-Current eFuses for 12V Hot-Swap Applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has also unveiled its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is being discussed. STMicroelectronics is showcasing their microcontroller innovations and ultra low power MCUs. They are committed to empowering edge AI innovation and advancing power electronics for aircraft electrification. STMicroelectronics' STM32 MCUs now support wireless connectivity. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with the U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.