Technology

Murata’s Low-Power Wi-Fi/Bluetooth Combo Module Revolutionizes Battery-Powered IoT Equipment

Murata has introduced a new low-power Wi-Fi/Bluetooth combo module called "Type 2GF" that is designed to support battery-powered IoT devices. This module includes the Infineon Technologies "CYW43022" chip for Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.

The IoT market has seen an increase in the variety of applications, leading to the development of IoT equipment with wireless communication capabilities. Different types of wireless communication functions are now needed for various applications, and there is a growing demand for lower power consumption in wireless communication functions for battery-powered devices.

In order to meet the need for low power consumption, Murata utilized their own wireless design technology and product processing technology to create a product that includes the CYW43022 chip. This chip enables the product to maintain connectivity even when the host processor is in sleep mode, reducing power consumption at the system level. Additionally, by using smaller noise shields, Murata was able to save space on the module and create a more compact product.

To find out more, please visit

Würth Elektronik has introduced a high-current inductor specifically designed for automotive use. Nexperia has launched the NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB offer low profile packages for bridge rectifiers. Würth Elektronik has unveiled the WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics is showcasing their microcontroller innovations and ultra low power MCUs. They continue to prioritize innovation and empower edge AI innovation. STMicroelectronics is also advancing power electronics for aircraft electrification and supporting wireless connectivity with their STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.

Related Articles

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button