Murata’s Low-Power Wi-Fi/Bluetooth Combo Module: Revolutionizing Battery-Powered IoT Devices
Murata has released a new low-power Wi-Fi/Bluetooth combo module called "Type 2GF," designed to support battery-powered IoT devices. This module includes Infineon Technologies' CYW43022 chip for Wi-Fi, Bluetooth, and Bluetooth Low Energy connectivity.
In the past few years, the IoT market has seen a growth in the variety of applications, leading to an increase in IoT devices that have wireless communication capabilities. These devices now require different specifications for their wireless communication functions depending on their specific use. Additionally, there is a growing demand for lower power consumption in wireless communication functions for devices that are powered by batteries.
Murata has created a product with low power consumption by incorporating CYW43022, which can maintain connectivity even when the host processor is in sleep mode. This is achieved through the chip's Bluetooth stack and Wi-Fi network offloading capabilities. Additionally, the product was made more compact by using smaller noise shields on the module.
For additional details, please visit this
Other articles from various companies in the electronic components industry include Würth Elektronik announcing a high-current inductor for use in automotive applications, Nexperia introducing high-current eFuses for 12V hot-swap applications, and Vishay Intertechnology launching thin film chip resistors for high frequency applications up to 70 GHz. Additionally, Würth Elektronik has released power inductors for DC/DC converters, and there are low profile packages available for bridge rectifiers. STMicroelectronics continues to showcase innovation in microcontrollers and ultra low power MCUs, with a focus on empowering edge AI innovation and advancing power electronics for aircraft electrification. HyRel Technologies has successfully recertified to AS9100 standards, while Amkor has signed preliminary terms with the U.S. Commerce for a large contract in Arizona. JEDEC has also announced new standards for DDR5 MRDIMM and LPDDR6 CAMM for enhanced high-performance applications.