Murata’s Low-Power Wi-Fi/Bluetooth Combo Module: Revolutionizing Battery-Powered IoT Equipment
Murata has released a new low-power Wi-Fi/Bluetooth combo module, called the "Type 2GF," designed to assist in the growth of battery-powered IoT devices. This module includes the Infineon Technologies "CYW43022" chip for Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.
The IoT market has seen an increase in the variety of applications in recent years, leading to a rise in IoT devices with wireless communication capabilities. Different specifications for wireless communication functions are now needed based on the specific application. In addition, there is a growing demand for wireless communication functions in battery-powered devices to have lower power consumption.
Murata has created a product with low power consumption capabilities by incorporating CYW43022, a wireless design technology, and product processing technology. This chip allows the product to maintain connectivity even when the host processor is in sleep mode, reducing power consumption at the system level. Additionally, the product was made more compact by using smaller noise shields, saving space on the module.
To find out more, please visit
Würth Elektronik has introduced a high-current inductor for use in automotive applications. Nexperia has launched the NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has also unveiled the WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics is focusing on microcontroller innovations and ultra low power MCUs. The company continues to show its commitment to empowering edge AI innovation. STMicroelectronics is advancing power electronics for aircraft electrification and offering STM32 MCUs with wireless connectivity support. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.