Murata’s Low-Power Wi-Fi/Bluetooth Module: Revolutionizing Battery-Powered IoT Devices
Murata has brought to market a new low-power Wi-Fi/Bluetooth combination module called "Type 2GF" that is designed to support the growth of battery-operated IoT devices. This module includes the Infineon Technologies "CYW43022" chip, which combines Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.
The IoT market has seen growth in recent years, leading to an increase in IoT devices with wireless communication capabilities. Different applications now require specific wireless communication specifications, with a focus on lower power consumption for battery-powered devices.
Murata has created a product with low power consumption capabilities by incorporating the CYW43022 chip, which allows for connectivity even when the host processor is in sleep mode. This is achieved through the chip's Bluetooth stack and Wi-Fi network offloading capabilities. Additionally, the product was made more compact by reducing the size of noise shields typically used on modules, saving space.
To find out more, please visit
Würth Elektronik has introduced a high-current inductor for use in automotive applications. Nexperia has launched NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are designed for bridge rectifiers. Würth Elektronik has presented its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics is showcasing its microcontroller innovations and ultra low power MCUs. The company is committed to empowering edge AI innovation. STMicroelectronics is also advancing power electronics for aircraft electrification and supporting wireless connectivity with its STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with the U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance.