Murata’s Low-Power Wi-Fi/Bluetooth Module: Revolutionizing Battery-Powered IoT Devices
Murata has released a new low-power Wi-Fi/Bluetooth combo module called "Type 2GF" that is designed to help increase the use of battery-powered IoT devices. This module features the Infineon "CYW43022" chip, and is now in mass production.
In recent years, the IoT market has seen growth in the number of applications, leading to an increase in IoT devices with wireless communication capabilities. The requirements for these wireless communication functions have become more varied depending on the specific application. Additionally, there is a growing demand for lower power consumption in wireless communication functions for battery-powered devices.
To meet the need for low power consumption, Murata utilized their wireless design and product processing technology to create a product with CYW43022 integrated. This chip allows for connectivity maintenance even when the host processor is in sleep mode, reducing power usage at the system level. Additionally, the product was made more compact by using smaller noise shields, saving space on the module.
To find out more, please visit
Würth Elektronik is showcasing a high-current inductor designed for use in automotive applications. Nexperia has introduced NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are available for bridge rectifiers. Würth Elektronik has launched its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is being discussed. STMicroelectronics is highlighted for their microcontroller innovations and ultra low power MCUs. They are continuing to demonstrate their commitment to empowering edge AI innovation. STMicroelectronics is also advancing power electronics for aircraft electrification and supporting wireless connectivity with their STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.