Murata’s Low-Power Wi-Fi/Bluetooth Module Revolutionizing Battery-Powered IoT Equipment
Murata has introduced a new low-power Wi-Fi/Bluetooth combo module called "Type 2GF" to support the growth of battery-powered IoT devices. This module includes the Infineon Technologies "CYW43022" chip for Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.
In recent years, the IoT market has seen a growth in the variety of applications, leading to an increase in IoT devices with wireless communication capabilities. Different types of wireless communication functions are now needed, depending on the specific application. Additionally, there is a demand for wireless communication functions in battery-powered devices to have reduced power consumption.
Murata has created a product with CYW43022 integrated, utilizing their wireless design and product processing technology to ensure low power consumption. The CYW43022 chip allows for connectivity maintenance even when the host processor is in sleep mode, thanks to its Bluetooth stack and Wi-Fi network offloading capabilities. This helps reduce power consumption at the system level. Additionally, the product was made more compact by using smaller noise shields on the module, saving space.
To find out more, please visit
Würth Elektronik has introduced a high-current inductor designed for automotive applications. Nexperia has launched NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are available for bridge rectifiers. Würth Elektronik has unveiled its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics is focused on microcontroller innovations and ultra-low power MCUs. The company is committed to empowering edge AI innovation. STMicroelectronics is advancing power electronics for aircraft electrification and supporting wireless connectivity with STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance.