Technology

Murata’s Low-Power Wi-Fi/Bluetooth Module Revolutionizing Battery-Powered IoT Equipment

Murata has introduced a new low-power Wi-Fi/Bluetooth combo module called "Type 2GF" that is designed to support battery-powered IoT devices. This module includes the Infineon Technologies "CYW43022" chip for Wi-Fi, Bluetooth, and Bluetooth Low Energy connectivity.

In recent years, the IoT market has seen an increase in applications, leading to a rise in IoT equipment with wireless communication capabilities. The specifications for wireless communication functions have become more diverse, varying depending on the specific application. In particular, there is a growing demand for lower power consumption in wireless communication functions for battery-powered devices.

Murata has created a product with low power consumption by incorporating the CYW43022 chip, which allows for connectivity even when the host processor is in sleep mode. This is possible due to the chip's Bluetooth stack and Wi-Fi network offloading capabilities. Additionally, the product was made more compact by reducing the size of noise shields on the module.

To learn more, please visit this

Würth Elektronik has introduced a high-current inductor specifically designed for automotive use. Nexperia has launched the NPS3102A and NPS3102B High-Current eFuses for 12V Hot-Swap Applications. Vishay Intertechnology has released AEC-Q200 qualified Thin Film Chip Resistors for high frequency applications up to 70 GHz. GBJA and KBJB Low Profile Packages are now available for Bridge Rectifiers. Würth Elektronik has also presented its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics' commitment to innovation and empowering edge AI innovation is highlighted. STMicroelectronics is advancing power electronics for aircraft electrification and supporting wireless connectivity with STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.

Related Articles

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button