Murata’s Low-Power Wi-Fi/Bluetooth Combo Module Revolutionizes Battery-Powered IoT Equipment
Murata has introduced a new low-power Wi-Fi/Bluetooth combo module called "Type 2GF" that is designed to support battery-powered IoT devices. This module features the Infineon "CYW43022" chip for Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.
In the past few years, the IoT market has seen an increase in the variety of applications available, leading to a surge in IoT equipment that includes wireless communication capabilities. Different applications now require wireless communication functions with specific specifications tailored to their needs. Additionally, there is a growing demand for wireless communication functions in battery-powered devices to have lower power consumption.
Murata has used its own wireless design and product processing technology to create a product with low power consumption capabilities by incorporating CYW43022. This chip can maintain connectivity even when the host processor is in sleep mode, thanks to its Bluetooth stack and Wi-Fi network offloading capabilities. This helps reduce power consumption at the system level. Additionally, space was saved on the module by utilizing smaller noise shields, making the product more compact.
To find out more, please visit
Würth Elektronik has introduced a new high-current inductor specifically designed for automotive use. Nexperia has launched NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has also introduced the WE-MXGI series power inductors for DC/DC converters. Galvanic isolation is utilized for phase control. STMicroelectronics is leading the way in microcontroller innovations and ultra-low power MCUs. Their commitment to empowering edge AI innovation is evident. They are also advancing power electronics for aircraft electrification and supporting wireless connectivity with STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with the U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance.