Basler Unveils Compact CoaXPress 2.0 Camera for High-Performance Imaging
Basler introduces the CoaXPress 2.0 camera in a compact size with the Basler ace 2 V. This new addition to the ace 2 camera series features single-channel cameras in a small 29 mm x 29 mm design. The cameras are equipped with seven sensors from Sony's Pregius S series, available in both monochrome and color options. They offer a wide range of resolutions from 5 MP to 24 MP and can achieve frame rates of up to 212 fps. With a powerful CoaXPress 2.0 interface providing a high bandwidth of 12.5 Gbps, these cameras are part of Basler's comprehensive CoaXPress 2.0 portfolio, offering customers a selection of coordinated hardware and software components from a single source.
Devices and connections for optimal functionality
The ace 2 V cameras provide high-quality images through the use of Sony's Pregius S sensors and a wide range of firmware features. These features eliminate motion artifacts when capturing moving objects and the sensors' strong light sensitivity ensures clear images even in low-light conditions.
The ace 2 V cameras are compatible with the CoaXPress 2.0 interface, making them a good choice for upgrading Camera Link systems and other applications. These cameras allow for quick transmission of image data over long distances using just one cable to the host system. Additionally, the new models make it simple to create multi-camera systems that need accurate synchronization and real-time functionality.
Easy configuration of the system and quick incorporation into
Basler offers a variety of components for customers to build a full vision system, including CoaXPress 2.0 interface cards, LED lighting, C-mount lenses, and cables. The pylon Software makes it easy to integrate all these components quickly. The pylon vTools allow for the creation and integration of image processing functions in a short amount of time. The ace 2 V camera is a compact and high-performance option for customers looking to build a complete CoaXPress 2.0 vision system. By using all Basler's CXP components, customers can ensure smooth operation, reduce development time, and lower overall system costs. This streamlined integration process also shortens the time-to-market, as explained by Basler's Product Market Manager, Thomas Karow.
For additional details, please visit this
Other articles in the same industry include Pickering Interfaces expanding their range of PXI digital I/O modules, Infineon adding to their AIROC Wi-Fi 6/6E with CYW5591x microcontrollers, and element14 introducing new connectivity, power, and housing options from Phoenix Contact. Additionally, Infineon has expanded their radiation-hardened memory portfolio with 1 and 2 Mb F-RAMs, while AAEON has introduced 13th Gen Intel Core processing to the COM Express Type 10 form factor with their NanoCOM-RAP. Indium Corporation has also introduced a new high-reliability alloy for solder paste.
In an interview, STMicroelectronics discusses their microcontroller innovations and ultra low power MCUs, highlighting their commitment to fostering innovation. They also showcase their dedication to empowering edge AI innovation and advancing power electronics for aircraft electrification. Furthermore, STM32 MCUs from STMicroelectronics support wireless connectivity. Additionally, Radiflow and Garland Technology have partnered to enhance real-time anomaly detection.
Verne is a company focused on the future of mobility, while VIAVI has benchmarked the Spring 2024 O-RAN PlugFest as the U.S. NTIA pushes for O-RU development.