transcosmos Debuts at 2nd Metaverse Expo Tokyo Summer Show with EbuAction and Hosts Special Seminar: Embracing the Metaverse for Business

transcosmos made their first appearance at the 2nd Metaverse Expo Tokyo Summer Show with EbuAction and also participated in a special seminar. They hosted daily seminars at their exhibition booth, featuring key individuals from three top Metaverse platforms.

transcosmos has announced that they will be participating in the 2nd Metaverse Expo Tokyo Summer Show alongside EbuAction. The event will take place from July 3 to July 5, 2024 at Tokyo Big Sight in Japan. Additionally, the companies will be involved in a special seminar panel session that is co-sponsored by Metaverse Japan.

During the three-day event known as the 2nd Metaverse Expo Tokyo Summer Show, experts in the industry will be hosting seminars for attendees to gain insights into the newest trends and real-world examples of the Metaverse. On July 5th at 3:00 PM, Jin Mitsuda, who is the Department Manager of Metaverse Promotion Department at transcosmos, will be speaking about how businesses can embrace the Metaverse as part of his presentation.

Event: 2nd Metaverse Expo Tokyo Summer Show, co-sponsored by Metaverse Japan, will be hosting a session focused on the theme of utilizing the Metaverse for business. Industry experts will discuss the goals, benefits, and values created by collaborating with creators in the Metaverse. Real-world examples from popular platforms like VR Chat, Fortnite, and Roblox will be used to illustrate the business impact of the Metaverse. The session will take place on July 5, 2024, from 3:00 to 3:45 PM at the West Hall of Tokyo Big Sight in Japan. The event is organized by RX Japan Ltd.

The panelists included Louise Okazaki, who is a Department Manager overseeing Digital Business Development at Daimaru Matsuzakaya Department Stores Co., Ltd. Jin Mitsuda is a Department Manager at transcosmos inc. leading the Metaverse Promotion Department. Keita Noda serves as the CEO of EbuAction and is also a Representative at BORDER, a metaverse production studio. Shinko Osada is the Representative Director at General Incorporated Association Metaverse Japan and also holds the position of Director & Secretary General at General Incorporated Association Future Design Shibuya.

Sign up for the seminar at this link (translation not provided):

During the expo, seminars will be held at exhibition booths. At the transcosmos x EbuAction booth, visitors can learn about different business use cases on three popular metaverse platforms, as well as a new marketing strategy aimed at Generation Z and Generation Alpha. Representatives from Fortnite, Roblox, and ZEPETO, the top metaverse platforms for these demographics, will be hosting a seminar at the booth throughout the three-day event.

The schedules listed may change without warning. Make sure to verify the information at the exhibition booth.

transcosmos is a brand name that belongs to transcosmos inc. and is registered in Japan and various other countries. Any other company names or product/service names mentioned here are trademarks or registered trademarks of their respective companies.

Visit the hare for further details.

Pickering Interfaces will be exhibiting their industry-standard switching and simulation systems at the SMD Symposium. The SMTA Long Island, Michigan, and Ohio Expos will feature ROCKA branded products for exploration. Green Circuits is set to display advanced PCB solutions at the Small Sat Conference in 2024. Ras Al Khaimah will be hosting a Sustainable IT Summit for tech leaders worldwide. Vicor will be showcasing innovative power solutions to tackle high performance computing challenges at Tech Taipei in 2024. CE3S will be discussing strategic sourcing and distribution solutions at the SMTA Long Island Expo & Tech Forum.

HyRel Technologies has achieved recertification to AS9100 with no issues. Amkor has signed initial terms with the U.S. Commerce Department for a $2 billion project in Arizona. JEDEC has introduced new standards for DDR5 MRDIMM and LPDDR6 CAMM to improve high-performance capabilities.