Murata’s Low-Power Wi-Fi/Bluetooth Module: Revolutionizing Battery-Powered IoT Equipment
Murata is now selling a low-power Wi-Fi/Bluetooth combo module that is designed to support battery-powered IoT devices. This module, called Type 2GF, has been developed and is being produced by Murata. It includes the "CYW43022" Wi-Fi/Bluetooth/Bluetooth Low Energy combo chip from Infineon Technologies.
In the past few years, the IoT market has seen an increase in applications, leading to a growing demand for IoT devices with wireless communication capabilities. The requirements for wireless communication functions have become more varied, depending on the specific application. In particular, there is now a need for wireless communication functions in battery-powered devices to have lower power consumption.
Murata has created a product with low power consumption capabilities by incorporating CYW43022, using their own wireless design technology and product processing technology. The CYW43022 chip allows for connectivity even when the host processor is in sleep mode, reducing power consumption at the system level. Additionally, the product was made more compact by utilizing smaller noise shields, saving space on the module.
To learn more, please visit this
Würth Elektronik has introduced a high-current inductor for use in automotive applications. Nexperia has launched NPS3102A and NPS3102B high-current eFuses designed for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are available for bridge rectifiers. Würth Elektronik has unveiled its WE-MXGI series power inductors for DC/DC converters. There is a discussion on phase control with galvanic isolation. STMicroelectronics is showcasing its microcontroller innovations and ultra low power MCUs. The company continues to prioritize innovation and empower edge AI innovation. STMicroelectronics is also advancing power electronics for aircraft electrification and supporting wireless connectivity with STM32 MCUs. HyRel Technologies has recertified to AS9100 without any non-conformances. Amkor has signed preliminary terms with the U.S. Commerce Department for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance.