Accelerating Heterogeneous Integration: A Deep Dive into Intel Foundry’s EMIB Technology with 3DIC Compiler Co-Design and Analysis Solution by Synopsys IP

New Solution Speeds Up Integration for Intel Foundry's EMIB Technology with 3DIC Compiler Co-Design and Analysis, Along with Synopsys IP.

Other articles on energy-efficient technologies, distribution agreements, cyber resilience in Ghana, sustainability milestones by Fortinet, and STMicroelectronics' performance in the semiconductor industry are featured. There is also a discussion on STMicroelectronics' microcontroller innovations, commitment to empowering edge AI, and advancements in power electronics for aircraft electrification. Additionally, Infineon's expansion of AIROC Wi-Fi technology and Panasonic Industry's collaboration with ETH Zurich on asteroid exploration robotics are highlighted. Rohde & Schwarz's involvement in the AI-RAN Alliance and utilization of its testing and measurement expertise is also mentioned.