Murata Innovates Low-Power Wi-Fi/Bluetooth Combo Module for Battery-Powered IoT Equipment
Murata has released a new low-power Wi-Fi/Bluetooth combination module called the "Type 2GF" that is designed to help expand the use of battery-powered IoT devices. This module features the Infineon Technologies "CYW43022" chip, which combines Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.
In recent years, the IoT market has seen an increase in the number of applications, which has led to a rise in IoT equipment that includes wireless communication capabilities. Different applications now require wireless communication functions with specific specifications tailored to their needs. Additionally, there is a growing demand for wireless communication functions in battery-powered devices to consume less power.
Murata has created a product with low power consumption by incorporating CYW43022, a chip with connectivity processing capabilities, into its design. This allows the product to maintain connectivity even when the host processor is in sleep mode, reducing power consumption at the system level. Additionally, the product was made more compact by utilizing smaller noise shields, saving space on the module.
To find out more, please visit
Würth Elektronik has introduced a high-current inductor specifically designed for automotive use. Nexperia has launched NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has presented its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is also discussed. STMicroelectronics has showcased their microcontroller innovations and ultra-low power MCUs. They continue to prioritize innovation and empower edge AI innovation. STMicroelectronics is advancing power electronics for aircraft electrification and supporting wireless connectivity with their STM32 MCUs. HyRel Technologies has achieved recertification to AS9100 with no non-conformances. Amkor has signed preliminary terms with the U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance.