Murata Revolutionizes IoT Equipment with Low-Power Wi-Fi/Bluetooth Combo Module
Murata has released a new low-power Wi-Fi/Bluetooth combo module called "Type 2GF" that is designed to support battery-powered IoT devices. This module features the Infineon Technologies "CYW43022" chip, which combines Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.
The IoT market has seen an increase in the variety of applications being developed, leading to a growing demand for IoT equipment with wireless communication capabilities. Different specifications for wireless communication functions are now needed based on the specific application being used. In addition, there is a trend towards requiring lower power consumption for wireless communication functions in battery-powered devices.
Murata has created a product with low power consumption by incorporating CYW43022, a chip with connectivity processing capabilities, into its design. This chip allows the product to maintain connectivity even when the host processor is in sleep mode, reducing power consumption at the system level. Additionally, the product was made more compact by utilizing smaller noise shields, saving space on the module.
To find out more, please visit
Würth Elektronik has unveiled a new high-current inductor designed for use in automotive applications. Nexperia has introduced NPS3102A and NPS3102B high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications up to 70 GHz. GBJA and KBJB low profile packages are now available for bridge rectifiers. Würth Elektronik has also presented its WE-MXGI series power inductors for DC/DC converters. Phase control with galvanic isolation is discussed in an interview. STMicroelectronics is highlighted for its microcontroller innovations and ultra low power MCUs. The company's commitment to empowering edge AI innovation is emphasized. STMicroelectronics is advancing power electronics for aircraft electrification and supporting wireless connectivity with its STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance.