Murata’s Low-Power Wi-Fi/Bluetooth Combo Module Revolutionizes Battery-Powered IoT Equipment
Murata has introduced a new low-power Wi-Fi/Bluetooth combo module called "Type 2GF" that is designed to support battery-powered IoT devices. This module features the Infineon Technologies "CYW43022" chip, which combines Wi-Fi, Bluetooth, and Bluetooth Low Energy capabilities.
In recent years, the IoT market has seen a growth in the number of applications, leading to an increase in IoT devices that incorporate wireless communication capabilities. The requirements for wireless communication functions have become more varied, depending on the specific application. In the case of battery-powered devices, there is a growing demand for lower power consumption in their wireless communication functions.
Murata has created a product with low power consumption by incorporating CYW43022, utilizing their wireless design and product processing technology. This chip enables connectivity even when the host processor is in sleep mode, reducing power consumption at the system level. Additionally, the product was made more compact by using smaller noise shields, saving space on the module.
To find out more, please visit
Würth Elektronik has introduced a high-current inductor specifically designed for use in automotive applications. Nexperia has released the NPS3102A and NPS3102B High-Current eFuses for 12V Hot-Swap Applications. Vishay Intertechnology has launched AEC-Q200 Qualified Thin Film Chip Resistors suitable for high frequency applications up to 70 GHz. GBJA and KBJB Low Profile Packages have been developed for Bridge Rectifiers. Würth Elektronik has unveiled its WE-MXGI series power inductors designed for use in DC/DC converters. Phase control with galvanic isolation is also being discussed. STMicroelectronics is showcasing its microcontroller innovations and ultra-low power MCUs. They are committed to empowering edge AI innovation and advancing power electronics for aircraft electrification. STMicroelectronics' STM32 MCUs support wireless connectivity. HyRel Technologies has successfully recertified to AS9100 with no non-conformances. Amkor has signed preliminary terms with the U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM Standards for enhanced high-performance.