Technology

Murata’s Low-Power Wi-Fi/Bluetooth Combo Module: Revolutionizing Battery-Powered IoT Equipment

Murata has introduced a new low-power Wi-Fi/Bluetooth combo module called the Type 2GF, which is designed to help expand the use of battery-powered IoT devices. This module includes the Infineon CYW43022 chip, which combines Wi-Fi, Bluetooth, and Bluetooth Low Energy technology.

In recent years, the IoT market has seen an increase in applications, leading to a rise in IoT devices that incorporate wireless communication capabilities. These devices now require a variety of specifications for wireless communication depending on their intended use. Additionally, there is a growing demand for lower power consumption in wireless communication functions for devices that are powered by batteries.

To meet the demand for low power consumption, Murata utilized their wireless design and product processing technology to create a product with CYW43022 integrated. This chip enables connectivity even when the host processor is in sleep mode, thanks to its Bluetooth stack and Wi-Fi network offloading capabilities. As a result, the product consumes less power overall. Additionally, space was saved on the module by using smaller noise shields, making the product more compact.

To find out more details, please

Würth Elektronik has introduced a high-current inductor for automotive use, while Nexperia has launched high-current eFuses for 12V hot-swap applications. Vishay Intertechnology has released AEC-Q200 qualified thin film chip resistors for high frequency applications. GBJA and KBJB offer low profile packages for bridge rectifiers. Würth Elektronik also presents its WE-MXGI series power inductors for DC/DC converters. STMicroelectronics is showcasing its microcontroller innovations and ultra low power MCUs, demonstrating a commitment to fostering innovation. The company is also advancing power electronics for aircraft electrification and supporting wireless connectivity with its STM32 MCUs. HyRel Technologies has successfully recertified to AS9100 with no non-conformances, and Amkor has signed preliminary terms with U.S. Commerce for a $2 billion project in Arizona. JEDEC has announced DDR5 MRDIMM and LPDDR6 CAMM standards for enhanced high-performance applications.

Related Articles

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button